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5th International Workshop on Explosion, Shock-wave and H...

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发表于 2016-6-21 09:39 | 显示全部楼层 |阅读模式
学术会议
会议名称: International Workshop on Explosion, Shock-wave and High-velocity Phenomena 2016
所属学科: 一般力学与力学基础,固体力学,工程热物理
会议类型: 国际会议
论文是否检索: 不详 
开始时间: 2016-09-25
结束时间: 2016-09-28
会议地点: 北京市 海淀区 友谊宾馆
主办单位: 北京理工大学爆炸科学与技术国家重点实验室
承办单位:
摘要截稿时间:
全文截稿时间: 2016-07-01
联系人: Prof. Pengwan Chen
联系电话: 1068918740
电子邮件: eshp@bit.edu.cn
通讯地址:
邮编: -
网址: http://www.eshp2016.cn/

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会议背景:
       The objective of the triennial international ESHP conference is to create a forum where people involved inscientific research or industrial applications related to explosion, shock waves and high-strain-rate phenomena can meet and discuss results and ideas. The symposium is comprised of invited lectures and contributed presentations. Oral and poster presentations are arranged for the contributed presentations.

征文范围:
      The symposium is planned to discuss the recent progress of theoretical, numerical and experimental researches on explosion, shock waves and high-strain-rate phenomena. The symposium covers the following general topics but the category is not limited: deflagration, detonation, and shock chemistry of energetic and reactive materials; shock wave and related phenomena in condensed and gaseous phase; response of materials and structures under high strain rates; production of materials bu shock and dectonation waves (shocks induced phase transition and chemical reactions, explosive welding, Shock modification, etc); innovative application of high-energy-rate phenomena. Additional contributions from related areas are also welcome. The organizers of ESHP2016 would also like to organize three special seaaions:
      Session 1 Shock processing and production of materials, Organizers: Prof. Pengwan Chen & Prof. Kazuyuki Hokamoto
      Session 2 Numerical simulation of explosion and impact, Organizers: Prof. Cheng Wang, Prof. Xiaowei Chen & Prof. Zoran Ren
      Session 3 Dynamic behavior of materials at high strain rates, Organizers: Prof. Yulong Li & Prof. Daniel Rittel
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