关于PCB板虚焊的实验

皮皮虎

不知现在有没有相应的实验标准，专门用于考核电路板的虚焊这一块，请教。

cwladt

有，你是打算找实验室做实验还是找试验标准？

皮皮虎

回复 2 # cwladt 的帖子

我想先看看标准标，再决定做试验

cwladt

你给留联系方式？我联系你

szdlliuzm

这样的试验条件是很好设置的，用正弦试验就是10-300Hz或10-500Hz，定加速度2-5g, 如果是机械振动台就定振幅，10-55Hz，定振幅0.75mm.
也可以是随机振动，10-300（500）Hz，平直谱，均方根加速度2-5g,

szdlliuzm

如果是要做破坏性试验，提高加速度值就可以了。

皮皮虎

回复 6 # szdlliuzm 的帖子

是什么标准？

Jonah_K500

回复 1 # 皮皮虎 的帖子

JEDEC Specifications
1. JESD22-B108-A “Coplanarity Test for Surface-Mount Semiconductor Devices”, Jan., 2003.
2. JESD22-B103-B “Vibration, Variable Frequency”, June, 2002.
3. JESD22-A104-B “Temperature Cycling”, July, 2000.
4. JESD22-B104-B “Mechanical Shock”, March, 2001.
5. JESD22-A113-D, “Preconditioning of Non-Hermetic Surface Mount Devices Prior to Reliability Testing”, August 2003
6. J-STD-002B “Solderability Tests for Component leads, Terminations, Lugs, Terminals, and Wires”, February 2003.
7. J-STD-020C “Moisture / Reflow Sensitivity Classification for Non-Hermitic Solid State Surface Mount Devices”, July 2004
8. J-STD-033a “Standard for Handling, Packing, shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
9. J-STD-035 “Acoustic Microscopy for Nonhermetic Encapsulated Electronic Components
10. EIAJED-4701/301A “Resistance to Soldering Heat for Surface Mount Devices (SMD), Test Method 301A

IPC Specifications
1. IPC-A-610D, “Acceptability of Electronic Assemblies”, January 2000
3. IPC-SM-785 “Guidelines for Accelerated reliability Testing of Surface Mount Solder Attachments.”, November 1992
3. IPC-TM-650 “IPC Test Methods Manual”
4. IPC-9701 “Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachment”, January 2002

MIL Specifications
1. MIL-STD-202G, Method 210F “Resistance to Soldering Heat”, February 2002.  Must meet modified test conditions according to Dell requirement and Lead Free solder used.

皮皮虎

非常感谢！

atomjin

脚丫子真能踩，厉害！

huzilong

xiaohengjj

回复 8 # Jonah_K500 的帖子

丫的，整那么多出来，够猛！