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最近在研究散热设计,看了许多论文,看到一个多芯片散热的论文,我依据论文中的数据及建模方式写了APDL命令,却始终无法得到和论文中相似的结果,大家一起出招解决一下,我的命令行如下:
finish
/clear
/filname,mcm
/title,mcm
/prep7
keyw,pr_therm,1
et,1,solid90
mp,kxx,1,0.08
mp,kxx,2,0.0011
mp,kxx,3,0.0002
block,0,60,0,40,0,1.5
wpoff,30,20
block,-4,4,-4,4,1.5,1.6
block,-4,4,-4,4,1.6,2.3
wpoff,10
block,-2,2,-2,2,1.5,1.6
block,-2,2,-2,2,1.6,2.3
wpoff,-20
block,-2,2,-2,2,1.5,1.6
block,-2,2,-2,2,1.6,2.3
wpoff,10,10
block,-2,2,-2,2,1.5,1.6
block,-2,2,-2,2,1.6,2.3
wpoff,,-20
block,-2,2,-2,2,1.5,1.6
block,-2,2,-2,2,1.6,2.3
WPCSYS,-1,0
vglue,all
numcmp,all
smrtsize,6
mshape,1,3d
mat,2
vmesh,1,5,1
mat,1
vmesh,6,10,1
mat,3
vmesh,11
finish
/solu
antype,4
TRNOPT,FULL
LUMPM,0
NSUBST,5,8,3
OUTRES,ERASE
OUTRES,ALL,ALL
AUTOTS,1
TIME,5000
allsel
tunif,20
allsel
asel,all
asel,u,,,6,34,7
nsla,s,1
sf,all,conv,0.00001,20
allsel
VSEL,s,,,6
eslv,s
bfe,all,hgen,,0.0446428
allsel
vsel,s,,,7,10,1
eslv,s
bfe,all,hgen,,0.0223214
allsel
solve
finish
/post1
plnsol,temp
计算的结果为最高温度500度,而论文中的结果,最高温度只有245度,不知道哪里出错了,请大家一起来出招,用APDL命令,将该计算过程还原; |