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楼主 |
发表于 2009-8-11 23:00
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此图仿真一光纤环的缠绕,主要相对其进行热分析
由于光纤的直径很小,所以在单位上采用/units,uMKS让采用的尺寸放大
此模型的命令如下:
!利用循环来画此模型
*DO,I,1,3,1
XCENTER1=0.033265E6+(I-1)*0.00028E6!!垫纸层
*DO,J,1,10,1
YCENTER1=0.000125E6+(J-1)*0.00025E6
BLC5,XCENTER1,YCENTER1,0.00003E6,0.00025E6
*ENDDO
*ENDDO
!!!!
*DO,I,1,3,1
XCENTER2=0.033405E6+(I-1)*0.00028E6!空气层
*DO,J,1,10,1
YCENTER2=0.000125E6+(J-1)*0.00025E6
BLC5,XCENTER2,YCENTER2,0.00025E6,0.00025E6
*ENDDO
*ENDDO
!!!!!
*DO,I,1,3,1
XCENTER3=0.033405E6+(I-1)*0.00028E6!!光纤层
*DO,J,1,10,1
YCENTER3=0.000125E6+(J-1)*0.00025E6
CYL4,XCENTER3,YCENTER3,0.000125E6
*ENDDO
*ENDDO
!!!布尔运算
*DO,I,31,60
ASBA,I,I+30
*ENDDO
!!再补充圆芯
*DO,I,1,3,1
XCENTER3=0.033405E6+(I-1)*0.00028E6!!光纤层
*DO,J,1,10,1
YCENTER3=0.000125E6+(J-1)*0.00025E6
CYL4,XCENTER3,YCENTER3,0.000125E6
做热分析之前得先对所有的模型进行粘合,AGLUE
现在此命令产生的模型不能实现粘合 |
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